Welcome to EMVL 2026

4th International Conference on Embedded Systems and VLSI (EMVL 2026)

September 29 ~ 30, 2026, Virtual Conference



Program Committee Members
  • Adar Chowdhury, Lamar University, USA
  • Addisson Salazar, Universitat Politècnica de València, Spain
  • Alireza Valipour Baboli, University Technical and Vocational, Iran
  • Altynbek SHARIBAY, L.N. Gumilyov Eurasian National University, Republic of Kazakhstan
  • Amb Dr Assem Moussa, Lambustech university, Egypt
  • Andrej V. Plotnikov, Odessa State Academy, Ukraine
  • António Abreu, Polytechnic University of Lisbon, Portugal
  • Azlan Mohd Zain, Universiti Teknologi Malaysia, Malaysia
  • Christian Mancas, Ovidius University at Constanta, Romania
  • Diego Firmenich, Facultad de Ingeniería Universidad Nacional de la Patagonia, Argentina
  • Eric Yew Kee Wong, HONG KONG Chu Hai College, China
  • Figen Balo, Fırat University, Türkiye
  • Gajendra Sharma, Kathmandu University, Nepal
  • Ghani Albaali, Princess Sumaya University for Technology, Jordan
  • Gheorghe Asachi, Technical University of Iasi, Romania
  • Grigorios N. Beligiannis, University of Patras, Greece
  • Henrique S. Mamede, Universidade Aberta & INESC TEC, Portugal
  • Ibrahim Hamzane, Cadi Ayyad University of Marrakech, Morocco
  • João Calado, Polytechnic University of Lisbon, Portugal
  • João Manuel R. S. Tavares, Universidade do Porto, Portugal
  • Jose Silva, CINAMIL, Portugal
  • Khloud Al Jallad, AIU, Syria
  • Layth Abdulrasool Alasadi, University of Kufa, Iraq
  • Luisa Maria Arvide Cambra, University of Almeria, Spain
  • Méziane Aïder, USTHB, Algeria
  • Mirza Mujtaba Baig, University of the Cumberlands, USA
  • Mohammad Javad Ebadi, Chabahar Maritime University, Iran
  • Mohammed Alchaita, Al-Rasheed Private University for Science and Technology (RU), Syria
  • Natália Hrkotáčová, Constantine the Philosopher University in Nitra, Slovakia
  • Oleksii K. Tyshchenko, University of Ostrava, Czech Republic
  • Pascal LORENZ, University of Haute Alsace, France
  • Rao Li, University of South Carolina Aiken, USA
  • Sathish Kumar Selvaperumal, Asia Pacific University of Technology and Innovation, Malaysia
  • Siarry Patrick, Universite Paris-Est Creteil, France
  • Silvia Gaftandzhieva, University of Plovdiv Paisii Hilendarski, Bulgaria
  • Subhendu Kumar Pani, Krupajal Engineering College, India
  • Tatyana A. Komleva, Odessa State Academy, Ukraine
  • WEI CAI, QUALCOMM, USA
  • Wei-Chiang Hong, Harbin Engineering University, China
  • Xiaoyan Dai, KYOCERA Corporation, Japan
  • Zheng-Ming GAO, Jingchu University of Technology, China